Place of Origin: | CHINA |
Brand Name: | STM |
Certification: | ROHS |
Model Number: | L6563STR |
Minimum Order Quantity: | 10PCS |
---|---|
Price: | Negotiation |
Packaging Details: | 2500PCS/BOX |
Delivery Time: | 2-3DAYS |
Payment Terms: | T/T, Western Union |
Supply Ability: | 50000PCS/WEEK |
Product Category: | Power Factor Correction-PFC | Installation Style: | SMD/SMT |
---|---|---|---|
Package/Box: | SO-14 | Package: | REEL |
Pd-power Dissipation: | 0.75 W | Factory Packing Quantity: | 2500 |
High Light: | power management ic,integrated circuit components |
STMicroelectronics L6599ATDTR Professional Power Management PMIC IMPROVED High Volt RESONANT CONTROLLER
Features
Tracking boost function ■ Fast “bidirectional” input voltage feedforward (1/V2 correction) ■ Interface for cascaded converter's PWM controller ■ Remote ON/OFF control ■ Accurate adjustable output overvoltage protection ■ Protection against feedback loop disconnection (latched shutdown) ■ Inductor saturation protection ■ Low (≤ 100 µA) start-up current ■ 6 mA max. operating bias current ■ 1% (@ TJ = 25 °C) internal reference voltage ■ -600/+800 mA totem pole gate driver with active pull-down during UVLO ■ SO14 package
Pin connection
Pin description
Pin connection
Typical electrical performance
Overvoltage protection Normally, the voltage control loop keeps the output voltage Vo of the PFC pre-regulator close to its nominal value, set by the ratio of the resistors R1 and R2 of the output divider. A pin of the device (PFC_OK) has been dedicated to monitor the output voltage with a separate resistor divider (R3 high, R4 low, see Figure 35). This divider is selected so that the voltage at the pin reaches 2.5 V if the output voltage exceeds a preset value, usually larger than the maximum Vo that can be expected. Example: VO = 400 V, VOX = 434 V. Select: R3 = 8.8 MΩ; then: R4 = 8.8 MΩ ·2.5/(434-2.5) = 51 kΩ. When this function is triggered, the gate drive activity is immediately stopped until the voltage on the pin PFC_OK drops below 2.4 V. Notice that R1, R2, R3 and R4 can be selected without any constraints. The unique criterion is that both dividers have to sink a current from the output bus which needs to be significantly higher than the bias current of both INV and PFC_OK pins
Q1. What is your terms of packing?
A: Generally, we pack our goods in neutral white boxes and brown cartons.
If you have legally registered patent, we can pack the goods in your branded boxes after getting your authorization letters.
Q2. What is your MOQ?
A: We provide you small MOQ for each item, it depends your specific order!
Q3. Do you test or check all your goods before delivery?
A: Yes, we have 100% test and check all goods before delivery.
Q4: How do you make our business long-term and good relationship?
We keep good quality and competitive price to ensure our customers benefit ;
We respect every customer as our friend and we sincerely do business and make friends with them,It's not something that can be replaced.
Q5: How to contact us?
A: Send your inquiry details in the below,Click "Send"Now!!!
Shenzhen Hongxinwei Technology Co., Ltd
To adopt new technology,to produce products of quality,to offer high-class service.
Improve the management system continuously to meet customer requirement for high-quality products and services.
Why choose us?
Contact Person: Mr. 段
Tel: 86-755-82715827
Fax: 86-755-22678033
Smallest GSM GPRS Module SIM800C 0.35 Kg Lightweight Low Power Consumption
Combo Chip 3G GSM GPRS Module SIM808 SIMCOM Quad Band GPS GPRS Module
Dual band GSM GPRS Module 900/1800MHz Stable Performance RoHS Complaint
High Speed U7500 GSM GPRS Module With HSPA/UMTS/EDGE Wireless Single Band
USB 2.0 Interface LTE Modem Module LTE FDD B13 B17 700bcMHz NGFF ME206v- 561
4G To WiFi LTE GSM Module Security Monitoring For 38 Board All Netcom Video
Power Supply Huawei LTE Module ME906s-158 Module EDGE GSM GPRS Module
Full Netcom LTE 4G Module Wireless Downstream 450Mbps Unicom L850-GL
4 Layer PCB Assembly High Volume Medical Printed Circuit Assembly
FR-4 PCB Board Assembly Flash Gold Finger Surface Finish 0.3mm BGA Pitch
Through Hole PCB Assembly Immersion Gold Surface Finish With SMT DIP Service
Full Turnkey PCB Board Assembly Aluminium Based Board Max 1.8KG 600*400*4.2